| 摘要 |
PURPOSE:To form uniform and fine electron beam through holes over all surfaces by providing a liquid tight means that can make the reverse surface of a shadow mask liquid-tight on which the first hole is formed in the first etching process and the resistance layer formation process and the second hole in the second etching process. CONSTITUTION:A shadow mask member 10 is sent to the first etching container 21 that sprays an etching liquid from a small hole formation section side through a nozzle 21a. In this case, a large hole formation section side is made liquid tight with a film 31 consisting of polyethylene, polypropylene, or vinyl chloride that is wound on a roll 301. At this state, etching is performed until a small hole 13 with a specified diameter D3 and a specified depth is formed. Then a resistance layer is dried by the second drying container 25 and the film is wound on a roll 302 and then the large hole formation section side is exposed. In the second etching container 26, the etching liquid is sprayed from a nozzle 26a and a resistance layer 16 is exposed and then etching is performed until a large hole 14 is formed. |
