| 摘要 |
PURPOSE:To electroplate a metallic layer having excellent adhesiveness to a desired film thickness by subjecting a transparent conductive film on a transparent insulating substrate consisting of glass, etc., to electroless plating then moving electrolyte absorbed cotton attached to the periphery of an anode back and forth and energizing the anode without using a plating cell. CONSTITUTION:An Ni-P alloy 5 is electroless plates on the transparent conductive film 2 of In2O3, SnO2, etc., patterned on the surface of the transparent glass substrate 1. A negative electrode of a DC power source 11 is attached to an Ni-P electroless plating film 5 and the positive electrode of the power source 11 is attached to the anode 6 for electroplating. The cotton 7 absorbed and impregnated with a plating liquid of Cu, Au, Ag, etc., is attached to the top end thereof. A rod 8 which is electrically insulated by an insulating washer 9 from the anode 6 is moved back and forth, by which the plating liquid absorbed cotton 7 as the anode is energized while said cotton is moved back and forth on the Ni-P plating film as the cathode. The uniform metal plating film 13 having the excellent adhesiveness is thus formed by electroplating. |
