| 发明名称 |
SEMICONDUCTOR DEVICES PROVIDED WITH HEAT-DISSIPATING MEANS |
| 摘要 |
<p>A semiconductor device includes a radiator (33) fixed on a package (20), said package including a projection (30) formed on its surface, and said radiator (33) comprising a recess (31) for receiving said projection. The projection is fixed within the recess by resin. Such a fixing system can improve bonding of the radiator, to the package, and thermal efficiency.</p> |
| 申请公布号 |
EP0079238(A3) |
申请公布日期 |
1984.04.18 |
| 申请号 |
EP19820305961 |
申请日期 |
1982.11.09 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
AOKI, HIDEJI;SUGIMOTO, MASAHIRO;WAKABAYASHI, TETSUSHI;MURATAKE, KIYOSHI |
| 分类号 |
H01L23/367;(IPC1-7):01L23/36 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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