Apparatus and method for runnerless transfer molding of thermoset compounds

摘要

There is described, apparatus and method for runnerless transfer molding of thermoset compounds, comprising feeding plasticized compound directly into dies through gates and nozzles by means provided to transfer plasticized compound extrudate into a cylinder to be forced by a ram directly into the dies through nozzles and gates, and wherein cured compound in the cylinder may be readily withdrawn from said cylinder by withdrawal of the ram from said cylinder, and cured sprue of compound removed from said ram.