| 摘要 |
In a switching network in matrix form for megahertz frequency signals, including: a multilayer printed circuit board having a plurality of row signal lines located in a first plane, a plurality of column signal lines located in a second plane and extending transverse to the row lines, the row and column signal lines intersecting one another in an intersection area, control and/or shielding conductors surrounding the lines, and metal shields enclosing the planes; a crosspoint array integrated on a chip and providing a plurality of crosspoints for the intersection area, each crosspoint presenting two semiconductor switches arranged to couple a respective column signal line to a respective row signal line; and a shielded package enclosing the chip, each line is constituted by a balanced pair of stripline conductors and is terminated at each end by its characteristic impedance. Between two signal conductor pairs in a plane there are control or power-supply conductors which are grounded for high frequencies for shielding purposes. Each crosspoint includes a balanced amplifier having two amplifying paths with internal neutralization of crosstalk via additional non-operating transistors, and high impedance input and output circuits connecting the amplifier between its row and column lines, and the module is connected to the circuit board via plug-in socket elements fastened to the circuit board and mating plug connector pins fastened to the shielded package.
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