| 摘要 |
PURPOSE:To provide high temperature cream solder having improved solderability in connection of electronic parts, etc. by mixing high temp. solde powder, a small amt. of low temp. solder powder and a flux to obtain a creamy mixture thereof. CONSTITUTION:High temp. cream solder is prepd. by mixing high temp. solder powder of a Pb base, etc., >=0.1wt% solder powder of Sn-Pb (>=10% Sn) having good solderability and the m.p. lower than the m.p. of the high temp. solder and a prescribed amt. of a flux. The low temp. solder powder of the cream solder begis to melt first and spreads in the soldering part in the stage of soldering. When the temp. in the soldering part increases upon progression of heating, the high temp. solder powder melts and flows out on the previously spread low temp. solder. The reliable soldered part is thus obtd. |
