发明名称 ASSEMBLY OF AN ELECTRICAL COMPONENT AND A HEAT SINK ON A PRINTED CIRCUIT BOARD AND METHOD OF ASSEMBLING
摘要 <p>This invention is a means for assembling an electrical component in a casing (28) which in use generates enough heat to require a heat sink (26) on a printed circuit board (10). The casing (28) is mounted on studs (20) swaged into the base of the heat sink (26) and having projecting heads (25) which are tinned and fit in holes (35) in the board (10) so that the exposed ends can be soldered to the printed conductive pattern to hold the heat sink and component assembled with the board.</p>
申请公布号 EP0014558(B1) 申请公布日期 1984.04.11
申请号 EP19800300263 申请日期 1980.01.29
申请人 THERMALLOY INCORPORATED 发明人 JORDAN, WILLIAM D.;HUNDT, ROGER C.;PRITCHETT, JAMES D.
分类号 H01L23/40;H05K1/02;H05K3/30;H05K7/20;(IPC1-7):01L23/40;05K7/20 主分类号 H01L23/40
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