| 摘要 |
PURPOSE:To obtain a uniform photo resist pattern by reciprocating a developer nozzle rectangularly to a wafer diameter above the rotating wafer and thus spraying a developer over the diameter. CONSTITUTION:The wafer 31 is chucked 21 and rotated at 50rpm, and the developer is sprayed out of the nozzle 23 over the diameter. The nozzle 23 moves to left by a motor 28 rectangularly to the wafer diameter, the motor 28 reverses when a stopper 29a shields a sensor 30a from light, therefore the nozzle 23 moves to right and reverses again by a stopper 29b and a sensor 30b. This reciprocating motion enables the developer to evenly contact each position of the surface of the wafer 31; accordingly the dimension of a resist pattern after development is made nearly constant at any position, and dimensional differences are small also between wafers. |
