发明名称 METHOD FOR TESTING DOUBLE HEAT SINK DIODE
摘要 PURPOSE:To prevent the generation of contact inferiority by receiving the deformation of a bump electrode in an elastic area and to make it possible to obtain the application effect of a large current, by performing a durability test by a current equal to or more than a rated one in such a state that a double heat sink diode (DHD) is preset to a high temp. state. CONSTITUTION:DHD of a drawing is charged to a testing apparatus and heated from the outside by a heater so as to be raised to about 100 deg.C. In this high temp. state, a current of a predetermined value exceeding a rated one is applied to perform a test. In this DHD testing method, the max. temp. difference (T2max) generated immediately after the current of a diode pellet 5 consisting of a bump electrode 3 and a silicon pellet 4 and that of the glass sleeve 2 positioned around the diode pellet 5 becomes extremely smaller max. temp. difference (T1max) generated by a conventional testing method and, therefore, the deformation quantity of the bump electrode 3 becomes smaller and the generation of contact inferiority can be prevented.
申请公布号 JPS62126362(A) 申请公布日期 1987.06.08
申请号 JP19850267643 申请日期 1985.11.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKAYAMA OSAMU;KAMITAKI YUJI
分类号 G01R31/26 主分类号 G01R31/26
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