| 摘要 |
An apparatus in the form of a multilayered pad (P1,P2) is provided which has an adhesive layer (32) over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet (46) of pads into individual pads (P1,P2), placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads (P1,P2) to bond them to the board, and stitching (welding) wire (24) to a succession of pads (p1,P2) to complete a series of new connections. Some pads (P1) include plated-through-holes (40) enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques. |
