| 摘要 |
An inorganic filler component for use in resin-based direct dental filling materials comprises fumed or submicron silica which has been silane treated and coated with a thin coating of an active polymerizable monomer of the type used as the binder in making the composition. The use of such a submicron material permits the total filler loading of the composition to be increased substantially, thereby increasing both the compressive and diametrical tensile strength of the cured material as well as improving its polishability and resistance to wear, and reducing its susceptibility to water absorption.
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