| 摘要 |
PURPOSE:To simplify the structure and enhance heat radiating effect by providing a heat radiating bump to a part of the CCB bump and connecting it to a heat radiation pattern of substrate. CONSTITUTION:A CCB type semiconductor device 11 forms a plurality of heat radiating bumps 13 in addition to an ordinary CCB bump 12 and also forms ordinary signal channel patterns 15 on the substrate 14. Moreover, the heat radiating patterns 16 are arranged in the space between such patterns corresponding to the heat radiating bump 13 and on the other hand, such patterns are extended up to the lower part of substrate 14 and are connected to the integrally formed cooling apparatus 17. The CCB bump 12 is thermally bonded to the signal channel wiring pattern 15, while the heat radiating bump 13 to the heat radiating pattern 16, respectively. Therefore, heat generated by the semiconductor 11 is transferred to the heat radiating pattern 16, the cooling apparatus 17 and thereafter dissipated. |
