| 摘要 |
PURPOSE:To remove external defect of a thin plate to be generated during transportation by giving an inclination to each separating plate so that the one surface of thin plate is not in contact with the separating plate. CONSTITUTION:Each separating plate 4 and a groove 5 are inclined backward by theta from the vertical plane (Y-Y') so that the surface 1A to be worked on which element is formed of wafer 1 is not in contact with the separating plate 4 of jig. In this case, the main surface of separating plate 4 (and groove 5) is formed at a right angle for the upper surface of frame inclined by theta for the horizontal plane X-X'. Thereby, the surface 1A where elements are formed is always locted at the upper side of the inclined surface, the wafer always keeps the constant inclination without contactness with jig. Thereby, any damage by contactness and chipping can be prevented and defect on the appearance can be prevented. |
