| 摘要 |
PURPOSE:To reduce a floating capacitance and realize high speed operation by providing a pad for signal line termination to be disposed on a semiconductor substrate and a plurality of insulator regions at least a part of which is striped under the pad in the semiconductor substrate. CONSTITUTION:An isolation to be used for inter-element isolation is also formed just under the pad 13. An isolation 21 is composed of a polysilicon 22 and an insulating film 23 surrounding it and 23' is a thin insulating film. Thereby, the insulating film just under the pad 13 becomes thick. Accordingly, the floating capacitance is reduced, contributing to realization of high speed operation. |
