发明名称 SEMICONDUCTOR SUBSTRATE HEATING APPARATUS
摘要 PURPOSE:To heat or cool a heater block up to the specified temperature within a very short period of time by providing a cooling mechanism within a heating mechanism. CONSTITUTION:In a heater block 40, a heater 41 receives a signal of a temperature controller 47 and heats a heat plate 42 up to the specified temperature for the baking process. When a wafer is sent to the heater block, a coolant open/ close valve 46 is opened for the specified degree by the controller 47. Thereby, the coolant is circulated. As a result, temperature of heat plate 42 is lowered at a very fast rate. A temperature drop rate of the heat plate 42 is set at the prescribed value by adjusting an opening degree of the valve 46 by means of the controller 47 while the temperature of heat plate 42 is measured with a temperature sensor 48.
申请公布号 JPS5961027(A) 申请公布日期 1984.04.07
申请号 JP19820170319 申请日期 1982.09.29
申请人 TOSHIBA KK 发明人 ROKUSHIYA TERUMI
分类号 F27D11/00;H01L21/18;H01L21/22 主分类号 F27D11/00
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