发明名称 METHOD FOR DETECTING POSITION OF BONDING PAD
摘要 PURPOSE:To detect the position of a bonding pad accurately, by scanning the picture (pad part) of the bonding pad which undergoes binary coding in the specified two directions, thereby obtaining the center of the bonding pad. CONSTITUTION:Binary coding of the picture on the surface of a printed board including a bonding pad, which is received from a camera, is performed into a substrate part 1 and a pad part 2 by a computer and the like. Scanning is performed in the direction x (row direction) along an arbitrary first side 3 of the pad part 2. Thereafter scanning is performed in the direction y (column direction), which is vertical to the direction x. In the x direction, at first the scanning is performed form the first side 3 to the center O of the pad part 2. Then the rows m1, which are changed into the number of picture elements that are equal to the length of designed value l1 between the distance between opposite sides 4 and 5, are obtained. Then the scanning is performed from a fourth side 6 to the center O, and the rows m2, which are changed into the number of picture elements that are equal to the length l2, are obtained. The (y) coordinate of the center O is obtained by (m1+m2)/2.
申请公布号 JPS5960202(A) 申请公布日期 1984.04.06
申请号 JP19820172357 申请日期 1982.09.29
申请人 FUJITSU KK 发明人 IKEDA HIROSHI
分类号 H05K3/32;G01B11/00;G01B11/02;H01L21/60;H01L21/68 主分类号 H05K3/32
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