| 摘要 |
PURPOSE:To prevent disconnection of multilayer interconnection at stepwise portion by increasing thickness of upper layer interconnection as compared with that of lower layer interconnection. CONSTITUTION:The thickness d of upper layer interconnection 4 is increased by approx. twice as thick as the thickness d0 of lower layer interconnection. As the thickness of the interconnection 4 increases at this time, constrictions of a stepwise portion 5 of an interlayer insulating film 3 is eliminated to form a smooth bent 7. Thus, disconnection of the interconnection is obviated.
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