| 摘要 |
Circuit boards and methods of making circuit boards and dielectric materials for said circuit boards, with relatively high dielectric constants, excellent moisture resistance, and reduced tendency to incur changes in dimensions after processing. The method comprises blending in a polymer dispersion, a particulate filler material having a high dielectric constant and microfibrous material to form a slurry of polymer, filler, and fiber. A flocculant is added to the slurry to agglomerate the polymer particles, the filler particles, and the microfibers to produce a dough-like material. The dough like material is eventually formed into a sheet, and is thereafter dried. A conductive foil such as copper is then applied to both sides of the sheet to provide a circuit board. |
