发明名称 |
VERFAHREN ZUM VERBINDEN EINES ALUMINIUMDRAHTES |
摘要 |
A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion. |
申请公布号 |
DE3335848(A1) |
申请公布日期 |
1984.04.05 |
申请号 |
DE19833335848 |
申请日期 |
1983.10.03 |
申请人 |
HITACHI,LTD. |
发明人 |
SEKIBATA,MASAO;OTSUKA,KANJI;OHZAWA,YOSHIYUKI |
分类号 |
H05K3/32;H01L21/60;H01L21/607;H01R4/62;H01R43/02 |
主分类号 |
H05K3/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|