发明名称 |
POWER SEMICONDUCTOR DEVICE |
摘要 |
In power semiconductor components, whose housing consists of a metallic base plate (1) and a plastic upper part (2), the two parts must be permanently connected to one another. This is made more difficult, especially when contact is made with the component by pressure and the compression spring (16) makes the base (1) bulge. A reliable connection is achieved by riveting the frame (2) and base plate (1). <IMAGE> |
申请公布号 |
JPS5958856(A) |
申请公布日期 |
1984.04.04 |
申请号 |
JP19830155678 |
申请日期 |
1983.08.25 |
申请人 |
SIEMENS SCHUCKERTWERKE AG |
发明人 |
BUERUNAA EGAABATSUHIYAA;HERUBERUTO FUOOKUTO;DEIITAA BUNDAARITSUHI |
分类号 |
H01L23/32;H01L25/07;H01L25/18 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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