| 摘要 |
PURPOSE:To seal a body to be sealed completely by a method wherein an ultraviolet curing type resin is applied on the surface of a soldering section, the body to be sealed is radiated by ultraviolet rays from which heat waves are removed passing through refrigerant, the body to be sealed is cooled by the refrigerant, a coating is formed and a protective coating is baked. CONSTITUTION:An Si element 1 is soldered to the bottom of a radiator plate 2, a glass epoxy substrate 4 is superposed and a lead 8 is inserted into a hole 7, and a sealed space 5 is formed through compression bonding. Solder paste is applied to the hole 7 and heated, and a copper foil 6 is soldered 9 to the lead 8. A pigment, through which ultraviolet rays do not transmit, etc. are removed completely from the ultraviolet curing type resin, and decompressed and defoamed glass powder through which ultraviolet rays transmit is mixed in place of the pigment, etc. and applied thinly on the foil 6 and the solder 9. When an assembly 12 is placed on a cooling base 13 and ultraviolet rays are irradiated, hot waves are removed first by pure water 16, which is flowed back 19 and cooled 15, and only ultraviolet rays are radiated, and the assembly is cooled 13. Accordingly, a solid sealing coating 21 is completed, and no defect such as a pin hole is generated even when an epoxy resin 22 is superposed and baked. |
