| 摘要 |
PURPOSE:To improve the mechanical quantity coefficient of an oscillator, by cutting a piezoelectric raw plate by each half of the plate thickness from both sides of the raw plate so as to prevent the chipping produced at the ends. CONSTITUTION:First, a groove whose depth is a half the plate thickness of the raw plate is formed by cutting the upper side of the piezoelectric raw plate 6 with a diamond blade 7 as shown in figure (a). Then, the piezoelectric raw plate 6 turns the upside down as shown in figure (b) and the plate is separated into individual element chips by cutting the remaining half of the plate thickness with the diamond blade 7 similarly. More or less chipping takes place near the element center where the cutting groove from the upper and the lower sides is overlapped, but the effect on the vibration is less because the change in the center of thickness is zero in the thickness slip oscillator. Further, the junction line of the cutting from the upper and the lower sides is preferably regulated within the range of <=1/5 of the plate thickness at the center of the plate thickness. |
