发明名称 SEMICONDUCTOR CHIP CARRIERS AND HOUSINGS
摘要 PCT No. PCT/GB83/00198 Sec. 371 Date Mar. 30, 1984 Sec. 102(e) Date Mar. 30, 1984 PCT Filed Aug. 8, 1983 PCT Pub. No. WO84/00851 PCT Pub. Date Mar. 1, 1984.A circuit unit such as performing the function of a chip carrier. In one example, it is in the form of a thin square of insulating material having contact pads arranged side by side along the four edges of both major surfaces. The chip is secured substantially centrally of the insulating material and connections are made from it to the contacts on both of the major surfaces. The carrier has a lower insulating layer (5) having contacts (6) extending over its under surface and carrying the chip (14) on its upper surface. An insulating spacer (8) carries further contacts (12). Electrical connections (16 and 18) are made to the contacts (6 and 12). An insulating cover (not shown) then closes off the hollow interior, locating on a shoulder (10). The contacts (12) thus provide the contacts on the upper surface of the finished construction. A single layer construction is also disclosed. Double-sided chip carriers formed in this way are particularly suited for side-by-side mounting in racked manner, enabling maximum use to be made of the contacts on both of the major surfaces and facilitating flow of cooling air.
申请公布号 GB2127217(A) 申请公布日期 1984.04.04
申请号 GB19830021375 申请日期 1983.08.09
申请人 DAVID FRANK * BROWN;MICHAEL JOHN * ANSTEY 发明人 DAVID FRANK * BROWN;MICHAEL JOHN * ANSTEY
分类号 H01L23/12;H01L23/498;H01L23/538 主分类号 H01L23/12
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