发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a strong connection by selectively plating the wire connecting section of a lead frame made of Cu or Cu group alloy or Fe or an Fe group alloy with Cu. CONSTITUTION:The surface of base material itself made of Cu or a Cu group alloy or Fe or an Fe group alloy is hard, but its surface is changed into a soft material when the base material is plated with Cu. Since a wire is connected to the soft material section, adhesive strength is increased and the wire is not exfoliated, and the oxidation of the surface is prevented and connection is strengthened.
申请公布号 JPS5958833(A) 申请公布日期 1984.04.04
申请号 JP19820169392 申请日期 1982.09.28
申请人 SHINKAWA:KK 发明人 KOBAYASHI TOMIO
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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