发明名称 MANUFACTURE OF CERAMIC WIRING BOARD
摘要 PURPOSE:To obtain the high-reliability ceramic wiring board, cost thereof is low, by forming a main wiring pattern by a base metal and setting up an electrode made of gold to a necessary section. CONSTITUTION:Three layers of main wirings 2, 4, 6 on the ceramic wiring board 1 made of alumina, an enameled iron plate or the like are formed through thick- film printing, plating or the like by using the base metal such as copper, and insulating layers 3, 5 are formed among layers. The electrodes 7, 8 are manufactured in such a manner that gold bases are printed and baked at 500 deg.C or more and the melting point (889 deg.C on copper) or less of an alloy with gold in N2. According to the constitution, the electrodes of excellent adhesive strength and bonding property are obtained, gold wires 12 are bonded, and the electrodes are completed. According to the constitution, the high-reliability substrate, cost thereof is low and bonding property and adhesive strength thereof are excellent, is obtained.
申请公布号 JPS5958848(A) 申请公布日期 1984.04.04
申请号 JP19820168402 申请日期 1982.09.29
申请人 NIPPON DENKI KK 发明人 NITSUTA MITSURU
分类号 H01L23/12;H01L23/538;H05K1/00;H05K1/09;H05K3/46 主分类号 H01L23/12
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