HEAT ACTIVATABLE ADHESIVE WITH IMPROVED TEMPERATURE RESISTANCE

摘要

Thermoplastic adhesive compositions are described which comprise (a) a thermoplastic polymer, (b) an organic polymer having a plurality of functional groups available for crosslinking and (c) a crosslinking agent capable of reacting with (b). These adhesive compositions are heat activatable at low temperatures and exhibit delayed tack and improved temperature resistance. These adhesive compositions may be conveniently applied to substrates as solutions in volatile organic solvents and are particularly suitable for employment in bonding operations involving insulative materials such as thermal insulation and sound deadening insulation.