| 摘要 |
PURPOSE:To reinforce the strength of a stress concentrated part of a lead by a method wherein a hole part which generates the stress concentration of the lead is filled with a substance such as metal or non-metal. CONSTITUTION:A lead frame 1 consists of outer frames 2, inner frames 3, and leads 4. The lead part of the outer frame side out of a small holes 5 of each lead 4 forms fine outer leads 6, the top end part including the small holes 5 forms inner leads 7. A pellet mounting space 8 is formed by the top end surfaces of the leads 7. A base 10 composed of a ceramic plate is raised from under to the lead frame 1, superposed on the inner leads 7, and heat fusion is performed. A cap 12 is superposed on the base 10 and hermetically sealed. Thereafter, it is dipped into a solder solution, and accordingly the solder is deposited on the surfaces of the leads 4. As a result, the solder 15 comes into the small holes 5 of the leads 4 and thus blocks them. Consequently, the stress concentration becomes small, and therefore the strength of the leads enhances. |
