| 摘要 |
Printed-circuit boards for layer circuits are made contact with by soldering on terminal elements. In this case, it can be difficult to supply the soldering point with sufficient solder material. The terminal element contains a number of sprung sheet-metal tongues, at least one of which is bent with respect to the others in the shape of a pocket to form a terminal contour and provides little capability for the attachment of additional solder spheres or solder wire sections. According to the invention, a gap is therefore formed, in which the soldering material is arranged, between one of the sheet-metal tongues and a further sheet-metal part without a spring function. The gap can be formed in a simple manner by the sheet-metal tongues having an extension piece which is bent away with respect to the actual sheet-metal tongue in the opposite direction with respect to the terminal contour, forming a gap. The invention is used in particular for making contact with ceramic substrates on layer circuits. <IMAGE>
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