| 摘要 |
PURPOSE:To prevent a device breakdown due to resin charged with static electricity from occurring by a method wherein a semiconductor chip and external terminals thereof are enclosed by semiconductor resin mixed with conductive resin. CONSTITUTION:The electric terminals 12a, 12b of a semiconductor chip 11 are connected to the external terminals 14a, 14b through the intermediary of wires 13a, 13b to be led outside. The surroundings of the external terminals 14a, 14b including the semiconductor chip 11 and the wires 13a, 13b are enclosed by a resin 15. As for the enclosing resin 15, such as epoxy and the like with excellent adhesion to metals and mechanical properties is utilized mixing with a conductive resin such as polyacetylene and the like together with hardener simultaneously added to the epoxy, thereby obtaining the resin for enclosing purpose having semiconductivity with resistivity ranging approx. 10<6>-10<12>OMEGA.cm. Through these procedures, the static electricity generated in the resin 15 may be minimized. |
