发明名称 IMPROVEMENT OF RESIDUAL STRESS
摘要 PURPOSE:To decrease residual stress without cooling the surface having residual stress by subjecting the surface on the side opposite from the surface having the residual stress to high frequency induction heating at the frequency corresponding to the thickness of the plate then cooling the heated surface of itself. CONSTITUTION:A flat plate 5 is subjected to high frequency heating by an induction heating coil 4 from the surface 6 side of the plate 5 to generate such a temp. distribution as shown in the figure. There is a need for heating the plate at the high frequency as the thickness is smaller and therefore such a temp. distribution as shown in the figure is not realized unless the frequency corresponding to the plate thickness is selected. Then the plate is held compressed on the high temp. side (heated surface side) and held tensed on the lower temp. side in proportion to the temp. difference. If the plate is naturally cooled, the residual stress is reduced without cooling the surface having the residual stress.
申请公布号 JPS5954491(A) 申请公布日期 1984.03.29
申请号 JP19820164882 申请日期 1982.09.24
申请人 MITSUBISHI JUKOGYO KK 发明人 NAYAMA RISUKE;TAKANO GENTA;MATSUMOTO TAKERU;ONDA TOYOTAKA;AKITOMO NORIO
分类号 B23K31/00;C21D1/26;C21D1/30;C21D1/42 主分类号 B23K31/00
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