Epoxy resin composition and molded articles obtained therefrom.

摘要

An epoxy resin composition comprising (a) an epoxy resin, (b) an alkenylphenol polymer, (c) a curing promoter, (d) halogen compounds (compound) represented by the formula: <CHEM> and/or the formula: <CHEM> wherein X1 to X10 each represents a hydrogen, chlorine or bromine atom, at least three of X1 to X5 and at least three of X6 to X10 being chlorine or bromine atoms, and R represents an alkylene group or a hydroxyl-substituted alkylene group, and (e) a filler can give molded articles excellent in properties, particularly in heat resistance and flame retardancy, even if metal inserts are contained therein.