发明名称 AUTOMATIC BEVELLING DEVICE FOR WAFER
摘要 PURPOSE:To enable the high quality and efficiency machining of wafers by uprighting a carrier, lowering a feed arm and setting a plurality of wafers loosely among a pair of guide members, a bevel type grinding roller and a feed roller. CONSTITUTION:With a feed arm 5 positioned transversely, a carrier 7 stowing a plurality of wafers 6 is mounted, and the wafer 6 is retained with the grooves 7' of the carrier 7 and those of the feed arm 5. Then, the carrier 7 is made upright and the feed arm 5 is lowered for inserting a plurality of the wafers 6 in the deep divisional grooves of a pair of guide members 1 and 2 from the upper side, thereby setting the wafers 6 rather loosely on a bevel type grinding roller 3 and a feed roller 4 by the help of the own weight. And both guide members 1 and 2 fixed in an opposite direction and the wafers 5 kept approximately upright, the wafers 6 are turned with the rotation of the feed roller 4 and concurrently bevelled with the grinding roller 3. In this way, many wafers are automatically fed and high quality wafers can be bevelled at high frequency.
申请公布号 JPS62136359(A) 申请公布日期 1987.06.19
申请号 JP19850273326 申请日期 1985.12.06
申请人 TOSHIBA CERAMICS CO LTD 发明人 TORII HIROSHI;TEZUKA SABURO;MISU SHUICHI
分类号 B24B9/00;B24B9/06;H01L21/304 主分类号 B24B9/00
代理机构 代理人
主权项
地址