| 摘要 |
PURPOSE:To obtain simplified structure providing less circuit loss by forming a micro strip line for matching on a lower ceramic frame forming a package. CONSTITUTION:A micro strip line 8 for impedance matching to be connected to a lead 3 is formed on the lower ceramic frame. Thereby, when a high frequency signal is applied from the one side of the lead 3 extended externally, a high frequency signal having less reflection loss is inputted since an impedance is matched with a high frequency semiconductor element 7 and a micro strip line 8 for impedance matching in the input side formed on the lower ceramic frame. A high frequency semiconductor element 7 secured to the basic block consisting of metal is operated by such input. An output thereof passes the micro strip line 8 for matching in the output side formed on the lower ceramic frame and is then outputted to the other lead 3. Accordingly, a high frequency signal output with less reflection loss can be obtained. |
