| 摘要 |
<p>PURPOSE:To measure a temperature rise of the encasing vessel on inspection or after mounting easily by setting up a heat-electricity converting element approximately just under a region on which a semiconductor element is placed. CONSTITUTION:The heat-electricity converting element is set up approximately just under the semiconductor-element placing section of the encasing vessel. For example, structure in which a thermocouple is incorporated in a ceramic-package 1 is formed, the thermocouple is formed by a metal A7 and a metal B8 at that time, and a temperature change of potential difference due to the contact of the metals of a different kind of A and B can be detected through leads 4, 4'. The metals 7, 8 are printed and formed previously before the package is manufactured. Accordingly, since the thermocouple for measuring the temperature rise or a resistor is unified with the encasing vessel, a temperature can be measured easily on inspection, and heat can be controlled easily.</p> |
