发明名称 KAPSLINGSENHET FOR ELEKTRONISK ANORDNING
摘要 A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.
申请公布号 SE432336(B) 申请公布日期 1984.03.26
申请号 SE19780006921 申请日期 1978.06.15
申请人 THE BENDIX CORPORATION 发明人 1)R W * CARP;2)B E * WALKER JR;3)R J * HYDER;4)T F * GOSNELL SR;5)L D * LEADBETTER
分类号 H05K5/00;H01L23/02;H05K3/32;H05K3/34;H05K7/02;H05K7/14;(IPC1-7):05K5/00 主分类号 H05K5/00
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