发明名称 BONDING METHOD AND BONDING TOOL
摘要 PURPOSE:To eliminate the displacement of a metal ball by bonding through the process that the metal ball is attracted by a pressure setting surface during a first bonding by forming a through hole to be bored to the pressure setting surface of bonding tool in such a structure as assuring vacuum attraction and inactive gas injection. CONSTITUTION:A fine hole 2 for supplying a fine metal lead is provided along the axis of pressure setting surface of a bonding tool 1 and is connected to an apparatus for vacuum attraction and inactive gas injection. After a metal ball 7 is formed by fire flame or ignitor to a metal fine lead 6 supplied from the through hole 2 formed to the pressure setting surface, it is vacuum attracted from the through hole and thereby a metal ball 7 is attracted by the pressure setting surface 5. After the bonding is carried out to the first connecting surface 8 under this condition, inactive gas is injected, a metal fine lead 6 is smoothly supplied dependant on the movement of bonding tool 1. Next, pressure setting and bonding are carried out to the second connecting surface 9 and a metal fine lead 6 is cut.
申请公布号 JPS5951537(A) 申请公布日期 1984.03.26
申请号 JP19820162575 申请日期 1982.09.17
申请人 MATSUSHITA DENKI SANGYO KK 发明人 TAKEBASHI NOBUHAYA
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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