Thermal printing plate for a thermal printing device using the multilayer thick-film method
摘要
The invention relates to a thermal printing plate for a thermal printing device using the multilayer thick-film method on a substrate, in particular aluminium oxide or porcelain with a resistor layer as the upper active layer consisting of individual printing points. Each printing point has two thin metallic conductor tracks which are guided onto the resistor leaving a gap. The gap between the resistor and the conductor tracks is filled with a low-ohm resistor paste which overlaps the ends of the conductor paths and covers the side surfaces of the resistor located opposite them. In addition, a layer of glass may be arranged between the resistor and the ends of the conductor tracks.
申请公布号
DE3241227(C1)
申请公布日期
1984.03.22
申请号
DE19823241227
申请日期
1982.11.09
申请人
F & O ELECTRONIC SYSTEMS GMBH & CO, 6901 NECKARSTEINACH, DE