发明名称 Thermal printing plate for a thermal printing device using the multilayer thick-film method
摘要 The invention relates to a thermal printing plate for a thermal printing device using the multilayer thick-film method on a substrate, in particular aluminium oxide or porcelain with a resistor layer as the upper active layer consisting of individual printing points. Each printing point has two thin metallic conductor tracks which are guided onto the resistor leaving a gap. The gap between the resistor and the conductor tracks is filled with a low-ohm resistor paste which overlaps the ends of the conductor paths and covers the side surfaces of the resistor located opposite them. In addition, a layer of glass may be arranged between the resistor and the ends of the conductor tracks.
申请公布号 DE3241227(C1) 申请公布日期 1984.03.22
申请号 DE19823241227 申请日期 1982.11.09
申请人 F & O ELECTRONIC SYSTEMS GMBH & CO, 6901 NECKARSTEINACH, DE 发明人 OBSTFELDER, GUENTHER, 6940 WEINHEIM, DE;KREUTZE, GERHARD, 6901 NECKARSTEINACH, DE;LUETTIG, WINFRIED, 6901 HEILIGKREUZSTEINACH, DE
分类号 B41J2/345;(IPC1-7):B41J3/20;H05K3/12 主分类号 B41J2/345
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