| 摘要 |
<p>PURPOSE:To obtain a sealing device, which has wetproof property and is not degraded at a high temperature, by constituting a sealing resin by an epoxy resin, an epoxy resin with at least two phenolic hydroxyl groups, an organic phosphine compound and an organic silicon compound with a predetermined organic group. CONSTITUTION:One or two kinds of novolac type phenolic resins as a curing agent are added to the novolac type epoxy resin of 170-300 epoxy equivalent, not more than 10ppm Cl ions and not more than 0.1wt% hydrogenizing Cl, and compounded by 0.5-1.5 in phenolic hydroxyl group number/epoxy group number, triaryl phosphine is added by 0.01-5wt% of the sum of the epoxy resin and the curing agent, and the silane compound with one union of one of an alkoxyl group, an aryloxyl group or an acyloxyl group and Si such as tetramethoxysilane is added by approximately 0.01-10wt% to the sum of the epoxy resin and the curing agent. An inorganic filler is added as required. When the device is sealed with the resin, there is not leakage at a high temperature, the device of high wetproof property is obtained, and reliability is improved.</p> |
