| 摘要 |
PURPOSE:To obtain the titled compsn. superior in adhesive properties usable for a soldering mask, etc. for manufacturing a printed circuit plate, by incorporating a nitrogen-contg. cyclic compd., a photopolymerizable unsatd. bond-contg. phosphoric compd., a specified photopolymerizable compd., a thermoplastic org. polymer, and a photopolymn. initiator. CONSTITUTION:A photosensitive resin compsn. improved in adhesive properties by incorporating (A) 0.001-5pts.wt. of at least one compd. selected from a group of imidazole, thiazole, tetrazole, triazole and their derivs., (B) 0.001-5pts.wt. photopolymerizable unsatd. bond-contg. phosphoric compd., (C) 20-80pts.wt. photopolymerizable compd. having a terminal ethylene group, (D) 20-80pts.wt. thermoplastic org. polymer, and (E) 0.5-10pts.wt. sensitizer and/or sensitizing material for initiating polymn. of the unsatd. compds. (B) and (C) by irradiation of active rays. |
