发明名称 MOLDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 A method of making a molded circuit board includes forming a polymer base with a channel and an intersecting through-hole. The base is conductively coated by means of vacuum deposition to establish a circuit line. After the conductive coating is removed everywhere except the channel and the through-hole, a further conductive material is provided on the coating. The base is subsequently stress relieved and planarized.
申请公布号 GB2126428(A) 申请公布日期 1984.03.21
申请号 GB19830018482 申请日期 1983.07.08
申请人 JOHN * FLUKE MANUFACTURING COMPANY INC 发明人 ISMAIL MACIT * GUROL
分类号 H05K3/42;H05K3/04;H05K3/10;H05K3/28;H05K3/34;H05K3/38;(IPC1-7):05K3/04 主分类号 H05K3/42
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