发明名称 |
MOLDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR |
摘要 |
A method of making a molded circuit board includes forming a polymer base with a channel and an intersecting through-hole. The base is conductively coated by means of vacuum deposition to establish a circuit line. After the conductive coating is removed everywhere except the channel and the through-hole, a further conductive material is provided on the coating. The base is subsequently stress relieved and planarized. |
申请公布号 |
GB2126428(A) |
申请公布日期 |
1984.03.21 |
申请号 |
GB19830018482 |
申请日期 |
1983.07.08 |
申请人 |
JOHN * FLUKE MANUFACTURING COMPANY INC |
发明人 |
ISMAIL MACIT * GUROL |
分类号 |
H05K3/42;H05K3/04;H05K3/10;H05K3/28;H05K3/34;H05K3/38;(IPC1-7):05K3/04 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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