AUTOMATIC TEST EQUIPMENT ISOLATED TEST POINT DETECTION METHOD

摘要

A method for determining whether test probes of a test fixture on an automatic test equipment (ATE) device are in contact with the intended test points on an electronic assembly under test. The undetected failure of the test probes to contact the test points on the electronic assembly test, such as a printed circuit board can result in meaningless test results or lead to unnecessary further testing or replacement of nonfaulty components that tested as failed. The method is directed to detecting which test probes are not in contact with their corresponding test points on the electronic assembly undergoing test by ATE.