| 摘要 |
PURPOSE:To match the size of pellet supporting metal plate to a larger pellet among at least two pellets and realize reduction in size of package by assembling pellets of different elements on both sides of pellet supporting metal plate. CONSTITUTION:A pellet 1 forming a GaAs FET is connected, at the bottom surface formed as an electrode, to the surface of pellet supporting metal plate 2a on which a lead is partly extending, while a pellet 3 forming Si diode for protection to the rear surface 2a' of metal plate 1 at the bottom surface of substrate. The other electrode of pellet 1 is connected to both front and rear surfaces of opposing leads 5, 6, 7 through Au wires 4a, 4d, 4c, and also connected to the rear surfaces through the wires 4f, 4e. Under this condition, these connecting portions of pellets and leads are surrounded and sealed by a resin package 8. |
