发明名称 GRONDPLAAT MET GELEIDERPATROON EN WERKWIJZE VOOR HET VERVAARDIGEN DAARVAN.
摘要 1352557 Soldering KOLLMORGEN CORP 19 April 1971 [5 March 1970] 25179/71 Heading B3R [Also in Divisions H1 and H2] Through connections in a circuit board consisting of a dielectric board to which are adhered wires 14 Fig. 1G of copper coated with tin, indium or solder are made by projectile pins 23 also coated with tin, indium or solder. The board is heated to fuse the coatings.
申请公布号 NL173907(C) 申请公布日期 1984.03.16
申请号 NL19710003009 申请日期 1971.03.05
申请人 KOLLMORGEN TECHNOLOGIES CORPORATION TE DALLAS, TEXAS, VER. ST. V. AM. 发明人
分类号 H05K1/03;H05K3/10;H05K3/38;H05K3/42;H05K7/06;H05K13/04 主分类号 H05K1/03
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