| 摘要 |
PURPOSE:To prevent stains on the reverse side or underside of the material to be developed, by installing a nozzle for spraying a rinse soln. from the central side toward the outer border of the underside of said material below the chuck of a spinner. CONSTITUTION:A processing soln. 12 consisting of a developing soln. and a positive resist dissolved in said soln. is moved to the outer border of a wafer 2 and scattered arund by the centrifugal force. At that time, since the rotation of the spinner chuck 1 is slow and said force is small, the processing soln. 12 tnds to turn around the outer end of the wafer 2 to its underside. But, the rinse soln. 9 is jetted strongly against said outer end, so the soln. 9 does not turn around the end to the underside, and scatters around released from the outer end. Accordingly, the reverse side of the wafer is prevented form being stained with the soln. 12 during the development processing, hence trouble, such as staining of conveying systems in the following step, incapability of vacuum attraction holding of the wafer, or inferior alignment, can be prevented. |
