发明名称
摘要 PURPOSE:To improve the adhesive property of plating, by forming the metal plating layer after forming coating layer on the surface of metallic body by using the resin liquid containing polymeric polymer, oligomer and polymeric monomer containing phosphorus element in a molecule. CONSTITUTION:Resin liquid basically composed of polymeric polymer, oligomer containing unsaturated radical in a molecule and polymeric monomer containing phosphorus element in the molecule or the resin liquid basically composed of polymeric polymer, oligomer containing the phosphorus element in the molecule, is applied on the surface of metallic body. Next, active energy of electromagnetic waves taking source from electrolytic dissociative radiant rays, ultraviolet rays etc., is irradiated and base coating layer is formed by solidifying the above liquid. Metal plating layer is formed by vacuum vapor deposition method or sputtering method after heat treating the above coating layer at 60-180 deg.C, for about 1-10min. By the above method, the metal plating layer is efficiently formed even on chromate treated rough surface etc.
申请公布号 JPS5911664(B2) 申请公布日期 1984.03.16
申请号 JP19790063464 申请日期 1979.05.23
申请人 DAINIPPON TORYO KK 发明人 ICHIMURA YUTAKA;IWAMI TSUTOMU
分类号 B05D7/14;B32B15/04;B32B15/082;C23C14/02;C23C14/04;F21V7/22 主分类号 B05D7/14
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