| 摘要 |
PURPOSE:To improve workability after a wafer is divided into pellets by measuring the characteristics of several pellets formed to the wafer and numbering the predetermined positions of the Al deposited surfaces of the pellets and ranking the pellets when a semiconductor substrate is brought to the state of a wafer. CONSTITUTION:A large number of the semiconductor pellets 1 are formed to the semiconductor wafer 2 in a latticed shape, and characteristics are measured about each pellet 1 when the wafer is brought to the state before it is divided into the pellets. The acceptable or defective the pellets are selected, defective pellets are removed from a manufacturing line, and the characteristics of the pellets 1 are ranked because characteristics differ in the central section and peripheral section of the wafer 2 even in the pellets 1 reserved as acceptable. Numbers 3 corresponding to ranks are assigned at the predetermined positions of the Al deposited surfaces for forming electrodes of the pellets 1, and each pellet 1 is cut off along scribing grooves 4. A laser may be used or special ink may also be applied in order to assign the number 3 at that time. |
