PROCESS FOR THE PRODUCTION OF CHIP BOARDS HAVING THREE AND MORE LAYERS

摘要

A process for the manufacture of triple- and multi-layer particle board employing phenol formaldehyde resin compositions for gluing particles in the outer layers of the board characterized by the use of a phenol formaldehyde resin composition having a viscosity of about 30-90 seconds (4-mm DIN cup), a solids content of between about 30 and 39 percent by weight and an alkali content of less than 8 percent by weight is provided.