| 摘要 |
<p>Apparatus is disclosed for laser machining a work piece in an environment that is non-reactive to the material of which the work piece is made. In particular, the laser machining apparatus includes a chamber for readily receiving a work piece and means for moving the work piece along its X, Y, and Z axes with respect to the laser beam, while maintaining the purity of the machining environment. To this end, the machining chamber is mounted upon means for driving the machining chamber along X and Y axes. The machining enviroment is maintained within the machining chamber and a sealing means taking the form of a plate having a substantially flat surface, that is disposed of a substantially uniform distance from the peripheral edge of the machining chamber, so that the machining chamber may be driven without resistance by the moving means. The work piece is moved along the Z-axis, by means comprising a mounting plate rotatively disposed within the machining chamber and adapted to be coupled with drive means, whereby the mounting plate and the work piece secured thereto may be rotatively disposed with respect to the laser beam.</p> |
