| 摘要 |
PURPOSE:To prevent adherence of flux to the heating tip and increase reliability of soldering, by interposing a bar material that refuse adherence of solder between the heating tip and soldered position when reflow soldering an integrated circuit element to a printed circuit substrate. CONSTITUTION:An integrated circuit element 16 is temporarily fixed on specified printed conductor 17 of a printed circuit substrate 1. Flux is applied to the soldered position and a table 2 on which the substrate 1 is placed is driven by an operation controlling unit to position the line of pins 18 of the integrated circuit element 16 right under the heating tip 6. A for material 8 <=0.5mm. thick made of metallic material such as Al, Ti, stainless steel etc. that do not accept adherence of solder is brought into contact with the line of pins 18 by descent of a supporting mechanism 3. The high temperature heating tip 6 is lowered by an elevating device 4 to press the pins 18 through the bar material 8 and the printed conductor 17 and pins 18 are soldered. By presence of the bar material 8, flux does not adhere to the heating tip 6. |
