| 摘要 |
PURPOSE:To solder electronic parts on specified positions of a multilayer ceramic substrate at high accuracy, by forming a solder film at specified positions of the multilayer ceramic substrate, arranging and fixing electronic parts on it, and melting the solder film in the vapor layer of specified liquid. CONSTITUTION:After forming a solder film 4 by screen printing etc. at specified positions of an electronic circuit 2 on a multilayer ceramic substrate 1, electronic parts 3 are placed at specified positions on the multilayer ceramic substrate. Under this condition, the multilayer ceramic substrate 1 and electronic parts 3 are fixed with jigs 5. The jig 5 consists of a bottom plate 5a, a pressing plate 5b, a pressing fixture 5c and a spring 5d attached to the pressing fixture 5c and a U-shaped fixture 5e that connects the bottom plate 5a and pressing plate 5b. This is put in a vapor condensation heating device and liquid having boiling point higher than melting point of the solder and lower than breaking temperature of electronic parts 3 is heated by a heater 8. The solder films 2 are molten by vapor of the liquid 6 and electronic parts 3 are soldered at correct positions on the multilayer ceramic substrate 1. |
